As a hot-pressed hexagonal material, boron nitride (BN) exhibits a distinctive combination of chemical, electrical, mechanical, and thermal characteristics, making it ideal for demanding high-performance applications. BN ceramic nozzles are widely employed in high-temperature and high-performance industries such as aerospace and semiconductors. In recent years, these components have attracted significant interest owing to their following unique properties: 1.Exceptional Thermal StabilityWith melting point of approximately 2900°C, BN ceramic nozzle can be used for temperature 1800 °C and 2100°C separately in high vacuum and inactive gas environment. 2.Thermal Shock ResistanceBN nozzles can withstand rapid temperature changes without cracking. So it can be used in environments with dramatic temperature fluctuations dramatically. 3.Extreme Corrosion ResistanceBoron Nitride ceramic has high resistance to chemical corrosion like acids and alkalis. It can protect the nozzle from the materials it handles to reduce the risk of contamination and extend lifespan. 4.Self-lubricatingBN material is self-lubricating. It can make sure molten materials do not adhere to the nozzle, preventing clogging and ensuring smooth material flow. 5.Electrical InsulationBN is an excellent electrical insulator, so it is suitable for applications like high voltages or plasma.   Material Property Material Composition BN+ZrO2 99 BN Density 2.8–2.9 g/cm³ 2.0 g/cm³ Color White Graphite White Bending Strength 90MPa 35MPa Compressive Strength 220MPa 85MPa Thermal Conductivity 30 W/(m.k) 40 W/(m.k) Thermal Expansion Coefficient  (20-1000°C) 3.5 10-6/K 1.8 10-6/K Max working temperature In Inert Gas 1800 °C In Inert Gas 2100 °C   In High Vacuum 1800 °C In High Vacuum 1800 °C   In Atmosphere  900 °C In Atmosphere 900 °C   With exceptional thermal stability, excellent thermal shock resistance, outstanding electrical insulation, chemical inertness, and lubricity, we have developed a new series of nozzles for metal and glass processing, 3D printing, as well as applications in the semiconductor and aerospace industries.   1.Metal and Glass ProcessingBN nozzle is widely used in metal casting and glass manufacturing, where it is exposed to molten metals and glass in high temperature. BN’s high wet resistance to molten metals and glass, its chemical inertness guarantees smooth flow and prevent clogging. If you are looking for metal and glass processing nozzle, BN will be a good choice.   2.3D PrintingIn metal 3D printing, BN nozzles are used to deliver powdered materials or molten metals. Its thermal stability and low friction properties make sure consistent material flow, reducing wear and tear of equipment and improving print quality.   3.Semiconductor IndustryIn semiconductor industry, BN nozzles used in chemical vapor deposition (CVD) and some high-temperature processes. It is suitable to handle reactive gases and ensure precise deposition as it won’t produce chemical reaction even under extreme conditions.   4.Aerospace IndustryBN nozzle is used in rocket engines and thrusters. It has the ability to withstand extreme temperatures and resist thermal shock, which makes it an ideal use for directing high-velocity exhaust gases. The BN nozzle’s applications in metal and glass processing, 3D printing, Semiconductor and aerospace demonstrate its versatility and reliability. With its numerous advantages, BN nozzle continues to be a preferred choice for high-performance applications. Any more question about BN nozzles just feel free to contact us at +86 17759275863 or peter@novatekxm.com for more information.

While ceramics were historically valued primarily for artistic and domestic purposes, they now play a vital role in numerous industrial fields. In electronics, ongoing microminiaturization is driving ceramic engineers to transform non-functional packaging into functional device components, necessitating new materials and processing methods. The communications industry has already been transformed by fiber optics, and will further evolve with opto-electronic integrated circuits alongside component miniaturization. High-temperature superconductors promise breakthroughs including magnetic levitation trains, cheaper electricity, and enhanced MRI systems. Their applications will expand through micro-scale uses such as thin-film tapes in sensors and memory storage. The automobile industry already integrates significant amounts of ceramics and seeks advanced ceramic sensors for motion, gas, electrical, and thermal monitoring, as well as lightweight, high-strength engine parts. Ceramics also offer sustainable solutions via fuel cells, batteries, photovoltaic cells, and fiber-optic energy transmission. In healthcare, alongside diagnostic equipment, bioceramics are increasingly used in bone replacements and controlled-release chemotherapy capsules. As ceramics become stronger, more biocompatible, longer-lasting, and cost-effective, their medical applications will continue to grow.

1.Aln Basic Properties   Crystal Structure: Hexagonal wurtzite structure (similar to boron nitride and silicon carbide), characterized by high hardness, high melting point, and excellent thermal stability. Color: Typically grayish-white or light gray powder; pure single crystals can appear colorless and transparent. Density: 3.26 g/cm³. Melting Point: Approximately 2200°C (can reach up to 2500°C without decomposition under high-pressure nitrogen).   2.Characteristics and Advantages   High Thermal Conductivity: Theoretical value up to 320 W/(m·K), comparable to beryllium oxide (BeO) and copper, but non-toxic, making it an ideal thermal management material. Wide Bandgap: 6.2 eV (electron volts), suitable for high-temperature, high-power, and ultraviolet optoelectronic devices. Electrical Insulation: High resistivity (>10¹⁴ Ω·cm) and low dielectric constant (~8.8), ideal for high-frequency electronic devices. Chemical Stability: Resistant to acid and alkali corrosion (especially in dry environments), but slowly hydrolyzes in high-temperature humid air. Thermal Expansion Coefficient: 4.5×10⁻⁶/K (close to silicon), making it compatible with silicon-based chips.   3.Preparation Methods   Chemical Vapor Deposition (CVD): Used to produce high-purity thin films or single crystals. Direct Nitridation: Aluminum powder reacts with nitrogen or ammonia at high temperatures (800–1200°C). Carbothermal Reduction: Aluminum oxide mixed with carbon reacts in nitrogen at high temperatures (1600–1800°C). Sol-Gel Method: Suitable for synthesizing nano-sized powders.   4.Applications   Semiconductor Devices: High-temperature and high-frequency components (e.g., RF modules for 5G communication), substrates for UV LEDs. Electronic Packaging: High thermal conductivity substrates (e.g., heat sinks for LEDs and power modules). Surface Acoustic Wave (SAW) Devices: Due to high acoustic velocity (~6000 m/s) and low signal loss. Structural Ceramics: High-temperature crucibles, cutting tool coatings. Composite Materials: Mixed with polymers to enhance thermal conductivity (e.g., thermally conductive plastics).   5.Precautions   Toxicity: Powder may irritate the respiratory tract; protective measures are required. Processing Difficulty: High hardness increases cutting and polishing costs, often requiring hot pressing or spark plasma sintering (SPS) techniques.   6.Comparison with Other Materials   VS Aluminum Oxide (Al₂O₃): Thermal conductivity is over 10 times higher, but cost is also higher. VS Silicon Nitride (Si₃N₄): Aluminum nitride offers better thermal conductivity but slightly lower mechanical strength.   Aluminum nitride (AlN) holds an irreplaceable position in advanced electronics and high-temperature technologies due to its unique combination of properties. With the growth of 5G and electric vehicles, its demand continues to rise.

NOVATEK can provide a range of crucibles for electron guns, which can also be designed and customized to meet specific needs. May I know if you have chosen the most suitable crucible for aluminum plating? This article explains in detail how to choose it, let’s go down.   BN-TiB2 Crucibles   Aluminum will form alloys with tungsten crucibles, molybdenum crucibles, and tantalum crucibles, which cause corrosion on the inside of the crucible and also contaminate aluminum. At the same time, the film layer has been contaminated, such as the film being black, dark, and even spotted. Aluminum will also form yellow aluminum carbide with carbon in graphite crucibles, and the formed aluminum carbide will evaporate onto the sample, causing the film to turn yellow. The use of boron nitride crucibles, alumina crucibles, or quartz crucibles is prone to electron beam defocusing issues. The main reason is that the crucible is not conductive, and the excess electrons in the crucible accumulate, resulting in repulsion of the electron beam. The use of conductive boron nitride crucible aluminum plating can effectively solve the problems encountered with ordinary crucibles. The aluminum film is of high quality and the crucible has a long service life.   Common Causes of Crucible Breakage: The first reason is that the ramp/soak levels are wrong for that material. The second reason the user shuts the power supply off or has a very short ramp down time for power after the deposition is done. This causes the rapid solidification of the melt, and this stresses out the crucible liner.   Advantages of BN-TiB2 Crucibles: 1. Custom sizes available upon request. 2. The crucible is conductive and the electron beam can work normally. 3. It will not pollute the aluminum, and the plated aluminum film has high purity. 4. Recommended for aluminum evaporation. 5. The special design can effectively reduce the power of the electron gun. 6. The special design makes the crucible not easy to crack. 7. Intermetallic crucibles are both conductive and lubricious and are ideal for materials that have a tendency to creep up the sides of the crucible.   Intermetallic (BN-TiB2) E-Beam Crucibles   NOVATEK  produces a series of crucibles, and you can pick up according to the specific requirements and areas of application. If you need any E-Beam Crucibles, please feel free to contact us.