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AlN Aluminum Nitride Ceramic Substrate Metalized DPC

AlN Aluminum Nitride Ceramic Substrate Metalized DPC

AlN Aluminum Nitride Ceramic Substrate Metalized DPC

DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling.

  • MATERIAL

    Al2O3 / AlN

  • DENSITY

    3.30-3.70 g/cm3

  • COLOR

    white / grey
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▼ Description of Ceramic Substrates DPC

Direct Plated Copper (DPC) is the newest development in the field of Ceramic Substrate PCBs and using this method can result in copper thickness' ranging from 10um (≈ 1/3oz) to 140um (4oz). With DPC track printing and etching is then performed with the thin Copper allowing for very fine tracks and reduced undercutting.

DPC Ceramic Substrate is the long-proven standard for power electronic modules in industrial, home-appliances and automotive applications. Unipretec ceramic substrates DPC have an excellent performance/cost efficiency ratio. The great heat conductivity of Al2O3 (25 W/mK) and AlN (175 W/mK) as well as the high heat capacity make the substrate irreplaceable in power electronics. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes.

▼Main performance advantages

 ✔High Mechanical Strength  ✔Good Thermal Conductivity
 ✔ Excellent Electrical Insulation  ✔ Outstanding Chemical Stability
 ✔ Extremely High Service Temperature  ✔ Small Thermal Expansion Coefficient

▼Properties of Ceramic Substrates

 

▼Applications of DPC Ceramic Substrates

DPC ceramic substrates are recommended for power electronic modules (e.g. current inverters) using MOSFETs or IGBT semiconductor elements and diodes for widespread application fields in the industrial sector: electric motor drives, e.g. in tooling machines, cranes, textile-processing equipment, automation equipment, etc.
 
- Pumps
- Welding machines
- Electrical industrial vehicles (e.g. power drives for forklifts)
- Induction heating
- Industrial drives (e.g. escalators, conveyor belts, elevators, robots, and servo drives)
- Uninterruptable power supply to. data centers, hospitals, etc.
- Energy technology (e.g. photovoltaics, wind turbines, and energy distribution)
- White goods (e.g. air conditioners, washing machines, refrigerators, and warm water pumps)
- Automotive and traction
 
As high-performance circuit carriers for power electronic applications:
In such groups as power steering, start-stop systems, air conditioning compressors, water pumps, oil pumps, brakes, etc; Converters for hybrid or electrical power train; Battery chargers; Inductive charging systems; DC-DC converters; Rail vehicles such as locomotives, subway trains, trams and cable cars, etc; Communications.
ホットタグ : Alnセラミックメタライズボード AlN Ceramic DPC AlN Substrate DPC Aluminum Nitride Ceramic DPC Ceramic Substrate DPC
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関連製品

AlN Aluminum Nitride Ceramic Substrate Metalized DPC
AlN Aluminum Nitride Ceramic Substrate Metalized DPC

DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling. MATERIAL Al2O3 / AlN DENSITY 3.30-3.70 g/cm3 COLOR white / grey

詳細
AlN Aluminum Nitride Ceramic Insulators
AlN窒化アルミニウムセラミック絶縁体

AlNは優れた電気絶縁性と高い熱伝導性を備えており、高性能電子パッケージング材料として注目されています。UNIPRETECは、様々なアプリケーション環境向けにAlN材料をベースとした基板シリーズを提供しています。材料: 窒化アルミニウム色: グレー密度: 3.30 g/cm3熱伝導率: > 170 W/mK最高使用温度: 1200℃典型的な利点: 高い熱伝導性

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